发明名称 |
Anordnung mit Leistungshalbleitermodulen und mit Vorrichtung zu deren Positionierung sowie Verfahren zur Oberflächenbehandlung der Leistungshalbleitermodule |
摘要 |
<p>The device has a position molded body (10) that exhibits a plane-main surface (14) and a set of recesses (12), which accommodates semiconductor modules (40). Each recess exhibits a stopper, where each main surface of the semiconductor modules is positioned coplanar and aligned to the plane-main surface of the position molded body. The recesses are designed conically and run from another main surface (16) of the position molded body towards the former main surface of the position molded body in a partial section (18). An independent claim is also included for a method for simultaneous surface treatments of a set of power semiconductor modules.</p> |
申请公布号 |
DE102005052798(B4) |
申请公布日期 |
2007.12.13 |
申请号 |
DE20051052798 |
申请日期 |
2005.11.05 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
JOST, JAKOB |
分类号 |
H01L21/68;B05B13/02;B65D85/90;H01L21/56 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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