| 摘要 |
PURPOSE: An instant cooling light emitting diode is provided to improve heat exchange efficiency by conducting heat through a dielectric enclosing a chip, a substrate and a lead frame. CONSTITUTION: A substrate(32) includes a set of chips(31) on its surface. A glass cover with various specification and shapes is made of material with high heat exchange efficiency. The inner space of the glass cover is for a substrate and the body of the chip. The glass cover is filled with a dielectric(37). The heat is transferred by the dielectric(37) enclosing the chips(31), the substrate(32) and the lead frames(34). The dielectric may be a vacuum. |
