| 摘要 |
An apparatus and a method for testing an image sensor package are provided to reduce a testing process and time by automatically performing an electrical test and an image test after the image sensor package is manufactured. An image sensor package is received on a receiving unit(200) to be tested. A testing unit(300) performs electrical and image tests on the image sensor package by employing a lens and a light source at a side of the image sensor package. A jig(100) supports a package wafer(40w) having plural image sensor packages, which are respectively cut. A transfer unit(400) transfers the image sensor package from the package wafer to the receiving unit. A control and process unit(500) has a tester module, which performs at least one of the electrical and image tests of the image sensor package. A package pusher being elevated is formed on a lower portion of the package wafer. |
