| 摘要 |
A semiconductor device and a method for forming an interconnection structure for an encapsulated die having a pre-applied protective layer are provided to prevent damage to an interconnection build-up layer by improving a mismatch of CTE(Coefficient of Thermal expansion) between a die and a mounting board, or between the die and the interconnection build-up layer. An active region(12) of a die(14) is mounted toward a chip carrier substrate or a printed circuit board(16). The active region includes active devices, passive devices, conductive layers, and insulation layers according to an electrical design of the die. An electrical and mechanical interconnection is performed through a solder bump structure(20). Solder bumps are formed on a top part of an interconnection site(24) or the bump pads positioned in a top part of the active region. The solder bumps(22) are mechanically or electrically connected to a contact pad of a top part of the substrate or an interconnection site(26). |
