Integrated circuit package having side and bottom contact pads

摘要

A packaged integrated circuit device includes a substrate module, leads, an IC die having first and second sets of die contact pads, and an encapsulant. The substrate module has upper and lower sets of conductive contacts on its upper and lower surfaces, respectively. The upper set of conductive contacts is electrically connected to the lower set of conductive contacts. The first set of die contact pads is electrically connected to the upper set of conductive contacts. The second set of die contact pads is electrically connected to the leads. Certain embodiments are a multi-form packaged device having both leads and conductive balls supporting different types of external connections, such as BGA and QFN.

主权项

1. A packaged integrated circuit (IC) device, comprising:
a substrate module comprising:
an upper set of conductive contacts on an upper surface of the substrate module; anda lower set of conductive contacts on a lower surface of the substrate module;a plurality of leads; and an IC die comprising a first set of die contact pads and a second set of die contact pads, wherein:
at least one of the upper set of conductive contacts is electrically connected to at least one of the lower set of conductive contacts;at least one of the first set of die contact pads is electrically connected to at least one of the upper set of conductive contacts; andat least one of the second set of die contact pads is electrically connected to at least one of the plurality of leads.