LED base module and LED lighting device

摘要

An LED base module includes a substrate and several driving units disposed on the substrate. Each driving unit includes a circuit layer, a separating wall, an LED driving component, a packaging member, and two electrodes. The circuit layer, the separating wall, and the electrodes are disposed on the substrate. A portion of the substrate corresponding to each driving unit is provided with an LED area and an electronic component area defined by the separating wall. The LED driving component is disposed on a portion of the circuit layer arranged in the electronic component area. The packaging member is formed on the electronic component area to entirely cover the LED driving component. A portion of the circuit layer arranged in the LED bonding area is used to bond to an LED chip, and the separating wall is configured to separate the LED chip and the LED driving component.

主权项

1. An LED base module, comprising:
a substrate integrally formed as one body and having a plurality of carrying portions thereon, wherein each carrying portion has a first surface and an opposite second surface; and a plurality of driving units respectively disposed on the carrying portions of the substrate, wherein each driving unit comprises:
a circuit layer disposed on the respective carrying portion;a separating wall disposed on the first surface of said carrying portion, wherein the first surface has an LED area and at least one electronic component area, and the LED area and the electronic component area are defined by the separating wall;an LED driving component disposed on the electronic component area, wherein the LED driving component is electrically connected to a portion of the circuit layer arranged in the electronic component area;a packaging element formed on the electronic component area, wherein the LED driving component is embedded in the packaging element; andtwo electrodes disposed on the carrying portion and arranged outside the LED area and the electronic component area, wherein the electrodes are electrically connected to the circuit layer,wherein a portion of the circuit layer arranged in the LED area is provided for bonding to an LED chip, thereby establishing electrical connection between the LED driving component and the LED chip, and wherein the separating wall is provided for separating the LED driving component from the LED chip, thereby reducing thermal and electromagnetic interferences between the LED driving component and the LED chip.