摘要 |
An addition-curable silicone resin composition includes (A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (A-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal SiH group per molecule of 5 wt % or less, and (C) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on LED chips and imparts a good wire bondability. |
主权项 |
1. An addition-curable silicone resin composition comprising:
(A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule; (A-2) a branched organopolysiloxane of the average compositional formula (1) below which has at least two alkenyl groups per molecule
(R13-tR2tSiO1/2)p(R32SiO2/2)q(R3SiO3/2)r(SiO4/2)s (1) wherein R1 is independently an alkenyl group of 2 to 8 carbon atoms, R2 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms which contains no aliphatic unsaturated bonds, each R3 is independently R1 or R2, with at least two of the R3 groups on the molecule being R1, p, q, r and s satisfy the conditions 0.01≦p≦0.6, 0≦q, 0≦r and 0.1≦s≦0.9, with the proviso that p+q+r+s=1, and t satisfies the condition 0≦t<3; (B) an organohydrogenpolysiloxane of the average compositional formula (2) below which has a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and at least one SiH group per molecule of 5 wt or less
R43SiO1/2)a(R52SiO2/2)b(R5SiO3/2)c(SiO4/2)d (2) wherein each R4 is independently a hydrogen atom or a methyl group, with at least two of all the R4 groups being hydrogen atoms, each R5 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms which contains no aliphatic unsaturated bonds, and a, b, c and d satisfy the conditions 0.01≦a≦0.6, 0≦b, 0≦c and 0.1≦d≦0.9, with the proviso that a+b+c+d=1; and (C) an addition reaction catalyst. |