| 摘要 |
PROBLEM TO BE SOLVED: To divide a wafer into polygonal chips.SOLUTION: In a division device 1, a placing table 3 includes a plurality of spherical bodies 30, a placing surface 31 formed by connecting the vertices 30a of respective faces of the plurality of spherical bodies 30 brought into tight contact, and a base 32 for disposing the plurality of spherical bodies 30 in tight contact. Division means 4 is atmospheric pressure difference generation means for generating the atmospheric pressure difference between the pressure of a gas in contact with the lower surface Fb of a sheet F becoming the placing surface 31 side with the sheet F as the boundary, and the pressure of a gas in contact with the upper surface Fa of the sheet becoming the wafer W side.SELECTED DRAWING: Figure 1 |
