发明名称 THERMOSETTING RESIN COMPOSITION
摘要 The disclosure relates to the thermosetting resin composition containing (A) to (D): (A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups;(B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group;(C) a linear organopolysiloxane compound having an SiH group only at one terminal; and(D) a Pt catalyst.
申请公布号 US2016264779(A1) 申请公布日期 2016.09.15
申请号 US201314442403 申请日期 2013.11.11
申请人 JNC CORPORATION 发明人 TAJIMA AKIO;MATSUO TAKASHI;KAWABATA KIICHI;UENO YOSHIKO;AYAMA KOICHI
分类号 C08L83/04;H01L33/56 主分类号 C08L83/04
代理机构 代理人
主权项 1. A thermosetting resin composition containing (A) to (D) below: (A) a thermosetting resin containing an SiH group and an alkenyl group, the thermosetting resin being a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having an SiH group obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group; (C) a linear organopolysiloxane compound having an SiH group only at one terminal; and (D) a Pt catalyst.
地址 TOKYO JP