发明名称 |
THERMOSETTING RESIN COMPOSITION |
摘要 |
The disclosure relates to the thermosetting resin composition containing (A) to (D):
(A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups;(B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group;(C) a linear organopolysiloxane compound having an SiH group only at one terminal; and(D) a Pt catalyst. |
申请公布号 |
US2016264779(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
US201314442403 |
申请日期 |
2013.11.11 |
申请人 |
JNC CORPORATION |
发明人 |
TAJIMA AKIO;MATSUO TAKASHI;KAWABATA KIICHI;UENO YOSHIKO;AYAMA KOICHI |
分类号 |
C08L83/04;H01L33/56 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
|
主权项 |
1. A thermosetting resin composition containing (A) to (D) below:
(A) a thermosetting resin containing an SiH group and an alkenyl group, the thermosetting resin being a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having an SiH group obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group; (C) a linear organopolysiloxane compound having an SiH group only at one terminal; and (D) a Pt catalyst. |
地址 |
TOKYO JP |