Semiconductor package in package

摘要

A semiconductor package having a second semiconductor package or module integrated therein. The semiconductor package of the present invention typically comprises active and passive devices which are each electrically connected to an underlying substrate. The substrate is configured to place such active and passive devices into electrical communication with contacts of the substrate disposed on a surface thereof opposite that to which the active and passive devices are mounted. The module of the semiconductor package resides within a complimentary opening disposed within the substrate thereof. The module and the active and passive devices of the semiconductor package are each fully or at least partially covered by a package body of the semiconductor package.

主权项

1. A semiconductor package, comprising:
a substrate having at least one opening extending from a substrate top surface to a substrate bottom surface, wherein the substrate has a substrate conductive pattern disposed on the substrate top surface and a plurality of contacts disposed on the substrate bottom surface, the contacts being in electrical communication with the substrate conductive pattern; at least two electronic components attached to the substrate top surface and electrically connected to the substrate conductive pattern; an electronic module at least partially disposed within the opening and including a plurality of module contacts and a module body with a module top surface opposite to the module contacts, the electronic module further comprising:
a module substrate having a module conductive pattern disposed on a module substrate top surface, the plurality of module contacts disposed on a module substrate bottom surface, the module contacts being in electrical communication with the module conductive pattern; andan electronic module component attached to the module substrate top surface and electrically connected to the module conductive pattern, wherein the module body covers the electronic module component, and wherein the module body entirely covers the module conductive pattern; and a package body at least partially encapsulating the substrate, the electronic components and the electronic module such that the contacts of the substrate and the module contacts of the electronic module are exposed in a common exterior surface of the semiconductor package, the package body further overlapping and encapsulating the top surface of the module body, wherein the package body and the module body completely electrically isolate the module conductive pattern from the substrate conductive pattern.