发明名称 |
CAVITY PACKAGE WITH COMPOSITE SUBSTRATE |
摘要 |
An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad. |
申请公布号 |
US2016300781(A1) |
申请公布日期 |
2016.10.13 |
申请号 |
US201514952562 |
申请日期 |
2015.11.25 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
Xue Xiaojie;Sengupta Dipak |
分类号 |
H01L23/495;H01L23/552;H01L23/00;H01L23/043 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
1. An integrated device package comprising:
a package substrate comprising:
an insulator die pad comprising an insulating material; anda plurality of leads disposed about at least a portion of a perimeter of the insulator die pad; an integrated device die mounted over the insulator die pad; and a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity. |
地址 |
Norwood MA US |