MOISTURE AND/OR ELECTRICALLY CONDUCTIVE REMAINS DETECTION FOR WAFERS AFTER RINSE / DRY PROCESS

摘要

A method, device, and apparatus is provided for detecting moisture and/or electrically conductive remains on a wafer after the wafer is removed from a drying chamber of a processing tool that includes wet clean processing. Embodiments include fixing a wafer to an endeffector between a processing chamber and a FOUP, moving the wafer from the processing chamber toward the FOUP, detecting moisture and/or electrically conductive remains on the wafer, and delivering the wafer to the FOUP, if no moisture and/or electrically conductive remains are detected, or delivering the wafer to a buffer station, if moisture and/or electrically conductive remains are detected.

主权项

1. A device comprising:
an endeffector having a first surface and a second surface, opposite the first surface, the endeffector including means for holding a wafer proximate to the first surface; metal structures on the first surface of the endeffector connected to a voltage source; and a resistance, capacity, and/or inductance sensor connected to the metal structures.