Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure

摘要

A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

主权项

1. A liquid trigger material that is curable and suitable for forming a metal circuit, the liquid trigger material comprising:
an insulating gel comprised of a macromolecular material that is curable; and a plurality of trigger particles comprised of a chelation, the trigger particles being activated when irradiated by a laser having a first wavelength; wherein, the trigger particles are distributed in the insulating gel, providing a liquid trigger material to be cured having a viscosity of less than 10000 cP, and a dielectric constant between 2 and 6.5.