发明名称 Method for manufacturing sensor apparatus
摘要 In a method for manufacturing a sensor apparatus having a sensor chip disposed in a recess of a case, after the sensor chip is disposed in the recess of the case, an opening portion of the recess is closed with a sheet member. The sheet member can prevent foreign matters from intruding an inside of the recess during manufacturing steps. After that, a through hole is formed in the sheet member. Accordingly, the inside and outside of the recess communicate with each other, and the sensor chip can detect an external environment of the recess such as atmospheric pressure.
申请公布号 US6751858(B2) 申请公布日期 2004.06.22
申请号 US20010922801 申请日期 2001.08.07
申请人 DENSO CORPORATION 发明人 TOKUHARA MINORU;KATO YUKIHIRO
分类号 G01L9/04;G01L9/00;G01L19/06;H01L29/84;(IPC1-7):H05K3/30 主分类号 G01L9/04
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