LAMINATED ALUMINIUM PLATE AND TARGETS PRODUCED THEREFROM

摘要

Laminated aluminium plate and process for producing it. …Laminated aluminium plates which can be used as a target for coating by means of cathodic sputtering consist of a useful layer of pure aluminium (Al >/= 99.99) or of a binary or ternary alloy smelted on the basis of pure aluminium (Al >/= 99.99) and a carrier layer. …A laminated aluminium plate having a hardness in the carrier layer of HB >/= 70 is now to be developed which can be produced in a simple and inexpensive process and is suitable for the production of targets for the sputtering technique. …The novel laminated aluminium plate consists of a carrier layer of a hardenable alloy - preferably of AlMgSi type - and a useful layer of pure aluminium Al >/= 99.99) or of a binary or ternary alloy smelted on the basis of pure aluminium (Al >/= 99.99). …The overall structure is produced by roll-bonding at temperatures between 350 and 450 DEG C. The proportion of the carrier material is preferably 20 to 35% of the overall thickness. After the hot-rolling at a rolling degree of at least 20%, the laminated plate is solution-annealed between 450 and 540 DEG C metal temperature for less than 30 minutes, preferably less than 15 minutes, quenched in water and then subjected to heat-ageing for 2 to 16 hours at 160 to 180 DEG C. ……