发明名称 THIN FILM FORMING DEVICE
摘要 PURPOSE:To form the thin film of a high melting-point metallic material on a substrate with low residual stress at high yield by providing a table of an insulating material on a sample base also used as an electrode and furnishing an electrode for applying a high-frequency power and a sample holder on the table. CONSTITUTION:The table 301 of an insulating material is provided on the water- cooled sample base 3 also used as an electrode. A high-frequency power source 4 is connected to a coaxial cable 304 passing through the table 301 through a capacitor 5. A high frequency power is applied during the formation of a film on the surface of a sample 11 from a conductive electrode 302 of a jig 303 for holding the sample 11 through the electrode 302 connected to the coaxial cable 304 to generate a negative bias. By this method, the thin film of a high melting point metallic material having a desired low residual stress is formed on the sample 11 fixed by the jig 303.
申请公布号 JPH02205672(A) 申请公布日期 1990.08.15
申请号 JP19890027156 申请日期 1989.02.06
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 OZAWA AKIRA;YOSHIHARA HIDEO
分类号 C23C14/34;C23C14/50;H01L21/027;H01L21/285;H01L21/30 主分类号 C23C14/34
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