| 发明名称 |
Method of preparing a component for automated placement |
| 摘要 |
A method of preparing a component for automated placement is provided. The method includes disposing tacking medium on a substantially transparent member (210); engaging the tacking medium with the component (230); and imaging the component through the substantially transparent member (240).
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| 申请公布号 |
US5372294(A) |
申请公布日期 |
1994.12.13 |
| 申请号 |
US19940187029 |
申请日期 |
1994.01.27 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
GORE, KIRON;KAZEM-GOUDARZI, VAHID;TEO, HAI |
| 分类号 |
G01N21/84;H01L21/50;H05K13/04;H05K13/08;(IPC1-7):H05K3/30;H05K3/34 |
主分类号 |
G01N21/84 |
| 代理机构 |
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代理人 |
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| 主权项 |
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