发明名称 |
Three-dimensional multichip module |
摘要 |
Three-dimensional multichip module. The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module. Application to the association of integrated circuits in microconnection technology.
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申请公布号 |
US5373189(A) |
申请公布日期 |
1994.12.13 |
申请号 |
US19930099663 |
申请日期 |
1993.07.30 |
申请人 |
COMMISSARIATE A L'ENERGIE ATOMIQUE |
发明人 |
MASSIT, CLAUDE;NICOLAS, GERARD |
分类号 |
H01L25/065;H01L25/10;(IPC1-7):H01L23/02;H05K7/00 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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