| 摘要 |
<p>PURPOSE: To reduce the size of a multilayered printed-wiring board and also to contrive the improvement of the density of wirings by a method wherein connection pins for connecting conductor layers with each other are buried in the interiors of printed boards. CONSTITUTION: In a multilayered printed-wiring board 10 formed by laminating printed boards 1, which are respectively formed of each of conductor layers CL1 to CL8 and each insulating layer DL, into a multilayer, connection pins 3 for connecting electrically the layers CL1 to CL8, which respectively form each printed board 1, with each other are buried in the interior of the printed boards 1. Thereby, the effective utilization of each wiring region in the printed boards 1 is contrived and a miniaturization of the board 10 becomes possible. Moreover, by connecting the layers CL1 to CL8 with each, other via these pins 3, the connection paths between the layers CL1 to CL8 formed under the lower layers of the boards 1 can be made short.</p> |
