| 摘要 |
<p>PURPOSE: To prevent the leads of a resin-sealed semiconductor device from coming off and to raise the mechanical strength of the leads. CONSTITUTION: Concerning to a resin sealed semiconductor device, a polyimide film 7 is glued into a united body to a single surface of each lead 3 projecting from sealing resin 8. This polyimide film 7 is formed so as to have a width equal to or wider than the width of the lead, and extends over to the inside and outside of the external surface of the sealing resin 8. By this polyimide film 7, adhesion between the lead 3 and the sealing resin 8 is enhanced, and coming-off prevention of time lead 3 is realized. Besides, it becomes possible to raise the bending strength of the lead 3 at the outside surface of the sealing resin 8 by the polyimide film 7, and to raise the mechanical strength of the lead 3.</p> |
