发明名称 Method for producing thick crack-free coatings from hydrogen silsesquioxane resin
摘要 <p>This invention pertains to a method for producing crack-free, insoluble and greater than 1.25 mu m thick coatings from hydrogen silsesquioxane resin compositions. This method comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating said resin at a temperature of less than 500 DEG C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 mu m. The resins may be cured in either an inert or oxygen containing environment.</p>
申请公布号 EP0883165(A2) 申请公布日期 1998.12.09
申请号 EP19980304292 申请日期 1998.06.01
申请人 DOW CORNING CORPORATION 发明人 BREMMER, JEFFREY NICHOLAS;CHUNG, KYUHA;SAHA, CHANDAN KUMAR;SPAULDING, MICHAEL JOHN
分类号 B05D3/02;B05D7/24;H01L21/312;H01L21/314;H01L21/316;(IPC1-7):H01L21/312 主分类号 B05D3/02
代理机构 代理人
主权项
地址