发明名称 |
Method for producing thick crack-free coatings from hydrogen silsesquioxane resin |
摘要 |
<p>This invention pertains to a method for producing crack-free, insoluble and greater than 1.25 mu m thick coatings from hydrogen silsesquioxane resin compositions. This method comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating said resin at a temperature of less than 500 DEG C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 mu m. The resins may be cured in either an inert or oxygen containing environment.</p> |
申请公布号 |
EP0883165(A2) |
申请公布日期 |
1998.12.09 |
申请号 |
EP19980304292 |
申请日期 |
1998.06.01 |
申请人 |
DOW CORNING CORPORATION |
发明人 |
BREMMER, JEFFREY NICHOLAS;CHUNG, KYUHA;SAHA, CHANDAN KUMAR;SPAULDING, MICHAEL JOHN |
分类号 |
B05D3/02;B05D7/24;H01L21/312;H01L21/314;H01L21/316;(IPC1-7):H01L21/312 |
主分类号 |
B05D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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