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发明名称
DIVIDING AND POLISHING METHOD FOR CHIP RAW MATERIAL WITH SINTERED DIAMOND
摘要
申请公布号
JPH1199412(A)
申请公布日期
1999.04.13
申请号
JP19970302311
申请日期
1997.09.29
申请人
YSK KOGYO:KK
发明人
SHIMAZU TOSHIHIRO
分类号
B23D61/02;B23K1/19;B24D3/00;B24D3/06;B24D5/12;(IPC1-7):B23D61/02
主分类号
B23D61/02
代理机构
代理人
主权项
地址
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