| 摘要 |
PROBLEM TO BE SOLVED: To implement thinner structure, lower the cost with higher performance of a package having a lead-on-chip(LOC) structure, in which bus bar leads are provided. SOLUTION: The part of a power supply lead 3V connected to a bus bar lead 3C is bent toward the main surface of a semiconductor chip 2, and the chip 2 is supported by and fixed to the lead 3V via an adhesive layer 5 provided on the bent portion. A bus bar lead 3C and a signal lead 3S are arranged in a state in which they are apart from the main surface of the chip 2. |
