| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device of flip-chip type which is improved in productivity and yield, by a method wherein a mounting process where the semiconductor light emitting device is mounted on a board or a lead frame is simplified. SOLUTION: A semiconductor light emitting element 1 of flip-chip type is mounted on the mount 6a of a lead frame 6, the light emitting element 1 is electrically connected to the lead frame 6 through micro bumps 5 and 4 which are each formed in one piece with the P-side and N-side electrode, 33 and 2, of the semiconductor light emitting element 1, the surface of the light emitting element 1 opposite to its mounting surface is made to serve as a primary light extracting surface, and an anisoconductive resin layer 10 is laminated on the mount, 6a. The parts of an N-side and a P-side micro bump, 5 and 4, press-fitted into the anisoconductive resin layer 10 are turned electrically conductive to electrically connect the semiconductor light emitting element 1 to a base. |
