发明名称 LIQUID DELIVERY MOCVD PROCESS FOR DEPOSITION OF HIGH FREQUENCY DIELECTRIC MATERIALS
摘要 <p>A liquid delivery MOCVD method for deposition of dielectric materials such as (Ba, Sr) titanates and (Zr, Sn) titanates, in which metal source compounds are dissolved or suspended in solvent and flash vaporized at temperatures of from about 100 °C to about 300 °C and carried via a carrier gas such as argon, nitrogen, helium, ammonia or the like, into a chemical vapor deposition reactor wherein the precursor vapor is mixed with a metal oxide film on the substrate at a temperature of from about 400 °C to about 1200 °C at a chemical vapor deposition chamber pressure of from about 0.1 torr to about 760 torr. The process is carried out in a chemical vapor deposition system containing a liquid delivery and flash vaporization assembly (102) where the precursors are provided in lines (106, 110, 114) and supplied to vaporize a unit (120). Such process may for example be employed to form a (Ba, Sr) titanate dielectric material wherein at least 60 atomic % of the total metal content of the oxide is titanium. The high dielectric material of the invention may be used to form capacitive microelectronic device structures for applications such as dynamic random access memories and high frequency capacitors.</p>
申请公布号 WO2000037712(A1) 申请公布日期 2000.06.29
申请号 US1999029566 申请日期 1999.12.13
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址