| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which blisters occur in an insulating film layer due to the evaporation of a coupling agent layer in a multilayer wiring board where the insulating film layer is formed as an insulating layer on a board. SOLUTION: A plurality of organic resin insulating film layers 4 with a wiring conductor layer 3 formed on their top surfaces are bonded on a board by the use of an insulating adhesive agent layer 5 for the formation of a multilayer wiring board. A coupling agent layer 6 as thick as five molecular layers or below is formed on the top surface of the wiring conductor layer 3, by which the coupling agent layer 6 can be stopped from evaporating, and blisters are restrained from occurring in the insulating film layer 4. |
