发明名称 |
Electroless metal connection structures and methods |
摘要 |
Chips first packaging structures and methods of fabrication are presented which employ electroless metallizations. An electroless barrier metal is disposed over and in electrical contact with at least one aluminum contact pad of the chips first integrated circuit. The electroless barrier metal is a first electroless metal and is a different material than the at least one aluminum contact pad. An electroless interconnect metal is disposed above and electrically contacts the electroless barrier metal. The electroless interconnect metal is a second electroless metal, which is different from the first electroless metal. As an example, the electroless barrier metal comprises electroless nickel and the electroless interconnect metal comprises electroless copper.
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申请公布号 |
US6396148(B1) |
申请公布日期 |
2002.05.28 |
申请号 |
US20000501200 |
申请日期 |
2000.02.10 |
申请人 |
EPIC TECHNOLOGIES, INC. |
发明人 |
EICHELBERGER CHARLES W.;KOHL JAMES E.;RICKLEY MICHAEL E. |
分类号 |
H01L21/288;H01L21/60;H01L21/68;H01L23/31;H01L23/522;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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