| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy foil for printed wiring excellent in heat resistance, flex resistance, folding resistance, and electric conductivity, and to provide a method for producing the same. SOLUTION: The copper alloy foil for printed wiring, which is the most suitable for use in a flexible printed wiring circuit (FPC) board, can be obtained by adding 0.01 to 0.20 wt.% (in terms of a weight ratio to the total elements) Zr to oxygen-free copper so as to attain a tensile strength of 400 N/mm<SP>2</SP>or higher and an electric conductivity of 90% IACS or higher and forming the copper into a copper foil excellent in heat resistance, flex resistance, folding resistance, and electric conductivity. COPYRIGHT: (C)2005,JPO&NCIPI
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