| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device capable of improving the reliability of connection by a bump through a more sure and simple means. <P>SOLUTION: The semiconductor device is manufactured by a method wherein the bump is equipped on a substrate, an adhesive film having an elasticity (-55°C) of 100MPa-5GPa and a thickness of 5-40% of the height of the bump is applied on the bump to cover the same, and the adhesive film is equipped on the substrate so that the bump projects the film. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
