发明名称 POWER MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a power module that can prevent the generation of noises to the outside by enclosing all electrodes led from inner chips with a single noise absorber and embedding the noise absorber in a sealing gel for protecting the chip, and wherein its module main body is not necessary to be made larger because the noise absorber is installed alone. <P>SOLUTION: In the power module, a plurality of electrodes 8 to connect the chips with connection terminals are enclosed by a single ferrite core 15 at the same time, and the ferrite core chip is embedded in a gel silicon 14 for protecting chips. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207432(A) 申请公布日期 2004.07.22
申请号 JP20020373737 申请日期 2002.12.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 ARAI NORIYOSHI;HONDA YOSHIHISA
分类号 H01L23/28;H01L23/24;H01L23/552;H01L25/07;H01L25/18 主分类号 H01L23/28
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