PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PLASMA DISPLAY PANEL

摘要

Disclosed is a photosensitive resin composition containing a binder polymer (A) having a weight average molecular weight of 35,000-65,000, a photopolymerizable compound (B) having an ethylenically unsaturated bond, and a photopolymerization initiator (C). The component (B) contains a photopolymerizable compound (B1) having one ethylenically unsaturated bond, a photopolymerizable compound (B2) having two ethylenically unsaturated bonds, and a photopolymerizable compound (B3) having three or more ethylenically unsaturated bonds, and the ratio of the component (B3) to the total of the component (B) is 15-30% by mass.