| 摘要 |
<p>A circuit material, comprises a conductive layer; and a dielectric substrate disposed on the conductive layer, the dielectric substrate comprising, based on the total dielectric substrate composition, about 10 to about 60 vol. % of a fibrous web; and about 40 to about 90 vol. % of a cured resin system, wherein the resin system comprises up to 100 vol. % of a syndiotactic polybutadiene elastomer, and 0 to 40 vol. % of a particulate filler, based on the combined weight of the resin system and the particulate filler. Such circuit materials have improved tack and good mechanical and electrical properties.</p> |
