| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state image pick-up device in which rigidity of a translucent substrate is improved, curving of the translucent substrate is prevented, delivery thereof is improved, and cleanliness of the translucent substrate is maintained. <P>SOLUTION: In the method of manufacturing a solid-state imaging device 1 in which a cover glass 4 and a solid-state imaging element chip 2 are bonded via a spacer 5, a support body 12 is bonded onto a surface opposite to a surface where grooves 11 of the translucent substrate 10 are formed, during a process of bonding the translucent substrate 10 onto a solid-state imaging element wafer 20. <P>COPYRIGHT: (C)2008,JPO&INPIT |
