| 摘要 |
A substrate spin apparatus is provided to perform easily a process for cleaning a spin chuck by increasing a diameter of a back nozzle cap. A carrier(110) is formed to support a substrate and is rotated around a cavity shaft. A spin chuck(140) is arranged at an edge of the carrier in order to support an edge of the substrate. A back nozzle cap(130) is arranged in a center of the carrier. A back nozzle(160) is fixed to the back nozzle cap in order to inject a processing solution to a backside of the substrate. The back nozzle cap includes a flow path(170) for supplying a cleaning fluid. The flow path is positioned near to the spin chuck and includes an injection part(170a) for injecting the cleaning solution to the spin chuck. The number of the flow paths is equal to the number of the spin chucks.
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