发明名称 |
Metal polishing composition and method of polishing using the same |
摘要 |
A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent, and a chemical mechanical polishing method comprising bringing the metal polishing composition into contact with a surface to be polished and providing a relative movement between the surface to be polished and a polishing surface.
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申请公布号 |
US7547335(B2) |
申请公布日期 |
2009.06.16 |
申请号 |
US20050287386 |
申请日期 |
2005.11.28 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
SEKI HIROYUKI;YAMASHITA KATSUHIRO;AKATSUKA TOMOHIKO;INABA TADASHI |
分类号 |
B24D3/02;B24B37/00;C09C1/68;C09K3/14;H01L21/304 |
主分类号 |
B24D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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