发明名称 Metal polishing composition and method of polishing using the same
摘要 A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent, and a chemical mechanical polishing method comprising bringing the metal polishing composition into contact with a surface to be polished and providing a relative movement between the surface to be polished and a polishing surface.
申请公布号 US7547335(B2) 申请公布日期 2009.06.16
申请号 US20050287386 申请日期 2005.11.28
申请人 FUJIFILM CORPORATION 发明人 SEKI HIROYUKI;YAMASHITA KATSUHIRO;AKATSUKA TOMOHIKO;INABA TADASHI
分类号 B24D3/02;B24B37/00;C09C1/68;C09K3/14;H01L21/304 主分类号 B24D3/02
代理机构 代理人
主权项
地址