发明名称 |
Low-temperature sealing glass frit and method for preparing composite filler in glass frit |
摘要 |
The invention discloses a lower-temperature sealing glass frit and a method for preparing a composite filler in the glass frit. The lower-temperature sealing glass frit includes a glass powder and a negative thermal expansion composite filler with an adjustable thermal expansion coefficient. The thermal expansion coefficient of the low-temperature sealing glass frit into which the composite material and the glass powder is mixed can be adjustable so that the thermal expansion coefficient of the low-temperature sealing glass frit can match the thermal expansion coefficient of glass substrates packaging an OLED device to thereby improve the yield of the packaged OLED device. |
申请公布号 |
US9359248(B1) |
申请公布日期 |
2016.06.07 |
申请号 |
US201514686564 |
申请日期 |
2015.04.14 |
申请人 |
SHANGHAI TIANMA AM-OLED CO., LTD.;TIANMA MICRO-ELECTRONICS CO., LTD. |
发明人 |
Li Dandan |
分类号 |
C03C8/14;C03C8/24;C03C1/00;C08K3/36;C08K3/22 |
主分类号 |
C03C8/14 |
代理机构 |
Anova Law Group, PLLC |
代理人 |
Anova Law Group, PLLC |
主权项 |
1. A glass frit comprising:
a glass powder; and a negative thermal expansion composite filler including a plurality of composite materials and having an adjustable thermal expansion coefficient to be selected from a plurality of thermal expansion coefficients corresponding to preset composition ratios among the plurality of composite materials when the composite materials are mixed to form the negative thermal expansion composite filler. |
地址 |
Shanghai CN |