发明名称 |
Resin molding apparatus and resin molding method |
摘要 |
A resin molding apparatus includes a pair of metal molds respectively arranged so as to be insulated from the ground with insulating materials, and a molding portion including the pair of metal molds and to which a resin material is provided. At least one metal mold of the pair of metal molds is provided with electrodes at two points flanking the molding portion. A high frequency current generator capable of applying high frequency current having a frequency of about 10 kHz or more is connected to the two electrodes. |
申请公布号 |
US9370884(B2) |
申请公布日期 |
2016.06.21 |
申请号 |
US201013255586 |
申请日期 |
2010.03.10 |
申请人 |
THE DOSHISHA;HIDEYUKI KUWAHARA |
发明人 |
Kuwahara Hideyuki;Katayama Tsutao;Tanaka Kazuto |
分类号 |
B29C43/52;B29C33/08;B29C33/06;H05B3/00;B29C33/00;B29C35/12;B29C43/36;B29K105/08 |
主分类号 |
B29C43/52 |
代理机构 |
Keating and Bennett, LLP |
代理人 |
Keating and Bennett, LLP |
主权项 |
1. A resin molding apparatus comprising:
a press; a pair of metal molds respectively arranged in the press so as to be insulated from ground with respective insulating materials; a molding portion including the pair of metal molds; a pair of electrodes provided at two points flanking the molding portion and arranged on both sides of the molding portion in either metal mold of the pair of metal molds; and a high frequency current generator electrically connected through the pair of electrodes to the either metal mold and configured to generate heat at a surface portion of the molding portion in either metal mold by applying a high frequency current having a frequency of about 10 kHz or more between the pair of electrodes. |
地址 |
Kyoto JP |