发明名称 Resin molding apparatus and resin molding method
摘要 A resin molding apparatus includes a pair of metal molds respectively arranged so as to be insulated from the ground with insulating materials, and a molding portion including the pair of metal molds and to which a resin material is provided. At least one metal mold of the pair of metal molds is provided with electrodes at two points flanking the molding portion. A high frequency current generator capable of applying high frequency current having a frequency of about 10 kHz or more is connected to the two electrodes.
申请公布号 US9370884(B2) 申请公布日期 2016.06.21
申请号 US201013255586 申请日期 2010.03.10
申请人 THE DOSHISHA;HIDEYUKI KUWAHARA 发明人 Kuwahara Hideyuki;Katayama Tsutao;Tanaka Kazuto
分类号 B29C43/52;B29C33/08;B29C33/06;H05B3/00;B29C33/00;B29C35/12;B29C43/36;B29K105/08 主分类号 B29C43/52
代理机构 Keating and Bennett, LLP 代理人 Keating and Bennett, LLP
主权项 1. A resin molding apparatus comprising: a press; a pair of metal molds respectively arranged in the press so as to be insulated from ground with respective insulating materials; a molding portion including the pair of metal molds; a pair of electrodes provided at two points flanking the molding portion and arranged on both sides of the molding portion in either metal mold of the pair of metal molds; and a high frequency current generator electrically connected through the pair of electrodes to the either metal mold and configured to generate heat at a surface portion of the molding portion in either metal mold by applying a high frequency current having a frequency of about 10 kHz or more between the pair of electrodes.
地址 Kyoto JP