REDUCTIVE ELECTROLESS GOLD PLATING SOLUTION, AND ELECTROLESS GOLD PLATING METHOD USING THE PLATING SOLUTION

摘要

The present invention has an object to provide an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance. In order to achieve the object, as a reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target by electroless plating, an electroless plating solution containing a water-soluble gold compound, citric acid or a citrate salt, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt, hexamethylenetetramine, and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups is adopted.

主权项

1. A reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target, comprising:
a water-soluble gold compound; citric acid or a citrate salt; ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt; hexamethylenetetramine; and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups.