| 摘要 |
A packaged electronic component comprising at least one movable part, comprising lower and upper layers, each formed with a depression in an inwards- facing side of the component, the depressions forming a cavity witliin the component, a MEMs component rigidly joined at least one proxhnal location to the lower and upper layers, wherein the MEMs component extends from the at least one proximal location into tire cavity such that a distal region of the MEMs component can move witliin the cavity. |
