| 摘要 |
PROBLEM TO BE SOLVED: To efficiently cool a heating component, with a small number of components.SOLUTION: A CPU 120 is mounted on a surface (a first surface) of a substrate 110. A heat radiating portion 140 has a plurality heat radiating portion fins 141, and is thermally coupled to the CPU 120. The plurality of heat radiating portion fins 141 extend in a direction separating from the surface of the substrate 110. A frame 150 is attached to the top surface of the substrate 110. A plurality of frame fins 152A are formed on the frame 150 so as to be disposed near the heat radiating portion 140. The plurality of frame fins 152A extend in the direction separating from the surface of the substrate 110. Then, at least a part of each of the plurality of frame fins 152A is provided more on a direction side from a root portion 141a toward a tip end portion 141b of the heat radiating fin 141, from the root portion 141a of the heat radiating fin 141.SELECTED DRAWING: Figure 1 |
