| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealed type semiconductor device that is adaptive to multiple pins and has a high reliability, and to provide a method of manufacturing such a resin sealed type semiconductor device more easily with stability.SOLUTION: A resin sealed type semiconductor device is configured to have: a circuit part that comprises a plurality of terminal parts each comprising an internal terminal surface and an external terminal surface front and rear integrally, so that the external terminal surfaces form one flat plane; a semiconductor element electrically connected with internal terminal surfaces of the terminal parts by a wire; and a resin member that encapsulates the terminal parts, the semiconductor element, and the wire in a state where at least the external terminal surfaces of the terminal parts are exposed. Each terminal part is configured to have a base, and a surface noble metal layer that configures the internal terminal surface, and have at least one of a recessed part and a rough surface on a side wall surface of the base.SELECTED DRAWING: Figure 15 |
