| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that manufacturing cost and chip area cannot be reduced because a formation area of an electrode pad is increased or the number of pads is increased, when electrode pads different in current capacity delivered and received to and from the outside exist in a semiconductor device. <P>SOLUTION: In the semiconductor device, an electrode pad with small current capacity of delivering and receiving to and from the outside is set as reference, and thinning of metal thread is realized. Connection with electrode pads 1 of an IC chip 2 is performed by using metal thread 5 of identical system. In electrode pad 1 with large current capacity of delivering and receiving to and from the outside, a bump electrode 13 is formed, and a plurality of metal threads 5 are connected. As a result, a large current capacity can be delivered and received, and manufacturing cost and chip area can be reduced. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
