发明名称 SEMICONDUCTOR APPEARANCE INSPECTION DEVICE AND SEMICONDUCTOR APPEARANCE INSPECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor appearance inspection device capable of performing appearance inspection automatically without depending on manual labor, even when different wiring materials are mixed. <P>SOLUTION: This appearance inspection device 1 is provided with an XY table 5 for positioning a frame 2 in the horizontal direction by being driven by an X-axis motor 3 and a Y-axis motor 4 and being moved in the horizontal direction, and a YZ table 6 for positioning the frame 2 in the vertical direction by being loaded on the XY table 5 and being moved in the direction at a narrow angle with respect to the horizontal plane. The device 1 is also provided with a Z-axis motor 7 for performing motion in the X-axis direction and driving the YZ table 6, and table deformation plate 8 for generating deformation in the Y-axis direction in the YZ table 6 by driving the Z-axis motor 7. The device 1 is also provided with an illumination means for irradiating the frame 2 with illumination light, a camera 12 for imaging the frame 2, and a movable lens 13 moved in the vertical direction for performing height measurement. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004226106(A) 申请公布日期 2004.08.12
申请号 JP20030011187 申请日期 2003.01.20
申请人 RENESAS TECHNOLOGY CORP;MITSUBISHI ELECTRIC ENGINEERING CO LTD 发明人 YAMAMOTO KANEHISA;SATO FUMIAKI;SUZUKI KOICHI
分类号 G01B11/24;G01N21/956;G06T1/00;G06T7/60;H01L21/60;H01L21/66 主分类号 G01B11/24
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