| 摘要 |
PURPOSE:To make stable TAB connection to a lead pattern provided on a substrate by making pattern end faces of lead patterns and those of lower-layer wiring patterns to intersect each other at a connecting area. CONSTITUTION:Pattern end faces of deep-layer patterns 4 are made to intersect those of lead patterns 7 which are provided above the patterns 4 with an insulating layer 3 in between at 45 deg. in a connecting area 6 where the pattern end faces of the patterns 4 are press-contacted at the time of TAB(tape automated bonding). When the lead patterns 7, on the other hand, are provided around the substrate 2 by the same number as that of leads 5 so that they can respectively correspond to the leads 5 when a chip 1 is face-down bonded and the chip 1 is put on the substrate 2, both patterns 4 and 7 can be connected at the same connecting area 6. |
