| 摘要 |
PURPOSE:To protect wire disconnection of a semiconductor device by bending and fixing the inner lead using level differences prepared in a heater block and lugs in a clamp block. CONSTITUTION:A lead frame to be installed on a heater block 1 is laid in a condition that an inner lead 8 thereof is in contact with an upper part 3a of a level difference 3 in the heater block 1 and that a tip 8a of the inner lead 8 is suspended aparting from a bottom 3b of the level difference 3. Now, when thrusting a tip 8a of the inner lead 8 downward by a lug 7 of a sheet clamper 6, the tip 8a bends in a space generated between the level difference 3 at the heater block 1 and the lug of the sheet clamper 6 and a reaction to be caused by the bending causes the lead to be fixed tight to the bottom 3b of level difference 3. The inner lead 8 thus fixed is treated by the supersonic wire bonding while being heated by the heater block 1. With this, the tip of the inner lead is sufficiently fixed without generating resonance by the supersonic wave, thereby being able to avoid the occurrence of wire disconnection during the execution of bonding. |
