HALFGELEIDERSCHAKELING-INRICHTING.

摘要

In such an arrangement a number of different parts formed on different wafers often need to be positioned so as to avoid electrical interference between them. This can be achieved by stacking the wafers and providing interconnections between the wafers. The wafers may carry antenna elements 1, or semiconductor circuits and are spaced by dielectric wafers 17. Interconnections are made by through plated apertures 9 between wafer surfaces and solder joints 23 between adjacent wafers.