发明名称 Electrical interconnect apparatus
摘要 An electrical interconnect apparatus (503) comprises a housing (500), an electrically conductive contact (209) and an electrically conductive spring member (211). The housing (500) has an electrically insulative outer layer (602) and an electrically conductive inner layer (603). The electrically conductive contact (209) includes a protrusion (311) having an edge (317) and partially displaced from a plane (307) of the contact (209) at an acute angle. The electrically conductive spring member (211), coupled to the electrically conductive contact (209), biases the electrically conductive contact (209) towards the housing (500) in a manner such that the edge (317) of the protrusion (311) extends through the electrically insulative outer layer (602) and into the electrically conductive inner layer (603) to form an electrical interconnection between the electrically conductive contact (209) and the electrically conductive inner layer (603).
申请公布号 US5373101(A) 申请公布日期 1994.12.13
申请号 US19930064613 申请日期 1993.05.19
申请人 MOTOROLA, INC. 发明人 BARABOLAK, MARK A.
分类号 H01R4/26;H01R13/658;H04B15/02;H05K3/32;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01R4/26
代理机构 代理人
主权项
地址