RESIN MOLD-COVERING METHOD FOR MOLDED RESIN PRODUCTS, RESIN MOLD-COVERING APPARATUS EMPLOYED IN THE SAME METHOD, MATERIAL USED FOR THE SAME COVER-MOLDING, AND MOLDED PRODUCT FORMED BY THE SAME METHOD.
摘要
申请公布号
EP0625418(A4)
申请公布日期
1997.07.09
申请号
EP19930913606
申请日期
1993.06.29
申请人
MATSUSHITA ELECTRIC WORKS, LTD.;NIPPON SHOKUBAI CO., LTD.
