| 摘要 |
PROBLEM TO BE SOLVED: To provide the pattern forming method high in sensitivity and patterning resolution and prevented from occurrence of lowering of solubility and cracking of a resin even in the case of leaving as it is for a long time or storing it for a long time in a film forming process. SOLUTION: This photosensitive polymer composition is composed essentially of (A) 100 pts.wt. of an aromatic polyamido acid, (B) 1-50 pts.wt. orotinic acid or chelidamic acid or its carboxylate derivative, (C) 1-100 pts.wt. of an amine compound, such as 2-(N,N-dimethylamino)ethyl methacrylate, and (D) 0.1-100 pts.wt. of a photoreaction initiator, such as paraazido compound. A pattern is formed by coating a substrate with this composition and drying it, and exposing the obtained photosensitive material to active rays and heat treating it and then, dissolving off the nonexposed part with an aprotic polar solvent. |
