| 摘要 |
PROBLEM TO BE SOLVED: To obtain double-side laminate by performing coating process of two or more polyimide resin on a specific conductive metallic foil in a precursor solution for heat-treating, which makes a one-side conductive polyimide laminate resin layer, on which other conductive metallic foil is stacked for laminating through contact bonding under overheated pressure. SOLUTION: One of the polyimide resin is low thermal expansion polyimide resin having unit structure, for example, represented by a formula (I), where R1 -R4 , is a lower alkyl group, a lower alkoxyl group, a halogen group, or hydrogen. Thermoplastic polyimide resin can be any resin having glass transition point of 350 deg.C or less, however preferably has sufficient interfacial bond strength, at the time of contact bonding under overheated pressure. For example, its unit structure is represented by formulas (II) and (III), where Ar1 and Ar2 are at least 12C dihydric aromatic group. |
